电子封装用针翅式金刚石/铜板材制备与水冷验证

Preparation and Water Cooling Verification of Pin-fin Diamond/Copper Plates for Electronic Packaging

摘要:

电子封装热管理问题是阻碍集成电路发展的重要技术瓶颈之一,金刚石/铜复合材料在热管理领域具有优异性能,但其异构成型困难导致在电子封装水冷领域的应用十分受限,针对此问题,本研究利用银掺杂策略来改善坯体与复合板材之间的烧结性能,制备出复合底板和针翅式复合底板,并验证了复合底板、针翅式复合底板分别在间接水冷、直接水冷场景中的应用效益。研究结果表明：银掺杂铜坯体可以与镀钨金刚石/铜复合板材具有良好的烧结性能；复合底板、针翅式复合底板在水冷测试中分别使得发热片温度下降5-6℃和4-5℃且其数值模拟结果与试验数据吻合良好,验证了其复合结构良好的均热特性,解决了传统封装部件热导率低以及金刚石/铜复合材料制备异型结构难的问题。

Abstract:

The issue of thermal management in electronic packaging is one of the important technical bottlenecks hindering the development of integrated circuits. Diamond/copper composites have excellent performance in the field of thermal management, but the difficulty in their complex structure formation leads to very limited applications in the field of water cooling in electronic packaging. In this study, we aimed to enhance the sintering performance between the green body and the composite plate by employing a silver doping strategy, thereby addressing the thermal management challenges in electronic packaging. We fabricated composite base plates and pin-fin type composite base plates and evaluated their application benefits in both indirect and direct water cooling scenarios. Our findings demonstrated that the silver-doped copper billet achieved good sintering performance when combined with tungsten-coated diamond/copper composite plates. The composite base plate and the pin-fin type composite base plate effectively reduced the temperature of the heating sheet by 5-6°C and 4-5°C during water-cooling tests respectively. The numerical simulation results were in good agreement with the experimental data, confirming the excellent thermal uniformity of the composite structures. This study successfully overcame the limitations associated with the low thermal conductivity of traditional packaging components and the challenges in fabricating complex structures using diamond/copper composite materials.