Cu／Mo／Cu爆炸复合界面组织特征

Microstructure of Cu/Mo/Cu Explosive Clad Interface

摘要:

用爆炸复合的方法，试制出了Cu/Mo/Cu板材。用光学显微镜和扫描电镜研究了其界面组织特征；并利用显微硬度考察了界面附近硬度及界面附近的形变特点。结果表明：Cu/Mo/Cu复合材具有波形结合面和平直结合面；波形界面存在熔区，其熔区的显微硬度高于Cu基体而低于Mo基体。

Abstract:

Cu/Mo/Cu(CMC)laminate is a new kind of composite with highl electrical conductivity and thermal conductivity. Especially, the CTE(coefficient of thermal expansion) of the laminate can be tailored by changing the cladding ratio, so a significant amount of CMC sheet is used in electronic industry for substrates of integrated circuits. At present, it is an ideal material to replace the pure molybdenum sheet. In this study, CMC laminate was produced with explosive cladding technique. The interface's morphology and microstructure were observed by means of OM. SEM. Microhardness measurements revealed the feature of deformation zone.