Ni—Ti焊料部分液相瞬间连接高纯Al2O3—Kovar工艺的研究

Partial Transient Liquid Phase Bonding of Al_2O_3 to Kovar with a Ni-Ti Filler

摘要:

通过Ti-Ti活性焊粒部分液相瞬间连接工艺，实现了高纯Al2O3陶瓷和可伐合金（Kovar）的气密性连接。结果表明焊缝区呈现明显的“三明治”夹层结构，两侧主要为Ti2Ni金属间化合物层，中间为较厚的Ti固溶体层。接头强度最初随保温时间延长增加，但与焊接温度之间没有明显的单调关系。

Abstract:

An airtight joint between high purity Al2O3 and the alloy Kovar was obtained using a partial transient liquid phase(PTLP) bonding technique with Ni Ti filler.A sandwich structure was observed in the soldered joint two side faces of the sandwich were Ti2Ni and at the center was thick layer of Ti solid solution.Shear testing indicated that the joint strength increased with increase of holding time,although a relationship between strength and joining temperature was not observed.