新型无铅焊料合金Sn-Zn-Ga的研究

The Study on the New Type Lead-Free Solder Alloys Sn-Zn-Ga

摘要:

以Sn-Zn合金为母合金，添加Ga元素，得到了新型的无铅焊料合金。测量了其熔点、硬度、剪切强度和可焊性等性能。研究发现，Ga元素的添加使焊料的熔点降低，熔程增大。焊料的硬度和剪切强度有所降低。焊料的铺展率增大，浸润角减小，提高了焊料的可焊性。通过实验研究确定了具有较好综合性能的焊料的成分范围。

Abstract:

The character of Sn-Zn-Ga solder alloy, including a series of properties tests, such as melting point, hardness, shear strength and solderability was studied. The results show that Ga element can decrease the melting point of solder alloys, but increase the melting range, and also reduce the hardness and shear strength of solder alloys. In addition, Ga element can enhance the wetting ability of solder alloys. The best composition of Sn-Zn-Ga lead-free solder alloy was obtained.