电子封装中的局部镀银研究

Investigation of Partial Silver-Piating in Electronic Packaging

摘要:

采用光化学蚀刻的技术，制备出细图案的引线框架，然后在引线框架的局部进行电镀镀银。分析了对银镀层质量产生影响的因素，发现预处理工艺和电流分布是影响银镀层质量的关键因素：电流密度会显著影响镀层表面粗糙度，电流密度为0．5A，dm。时，可以得到表面光滑的镀层；电镀时间是控制镀层厚度的另外1个因素，当电镀时间为12min～16min时，将形成比较均匀的局部镀银层。

Abstract:

A photolithograph technology is used to fabricate patterned fine lead frame, and the factor of partial silver-plating is discussed. We find the pretreatment and electroplating technology is the key of plating layer quality: 1, current density can influence the roughness of silver plating surface, if it is 0.5 A/dm2, we can get the smooth silver plating; 2, electroplating time also plays an important role in controlling plating thickness, we can gain the even silver plating after 12 min-16 min plating.