陶瓷基板化学镀铜预处理的研究

Research of Electroplating Cu on Pretreatment Ceramic Substrates

摘要:

为提高封装基板铜导体层与陶瓷基板的结合强度，研究了在氧化铝和氮化铝的基板上进行化学镀铜，对表面进行粗化和改性，经过优化工艺条件后，氧化铝与镀层的结合强度可以达到27MPa，氮化铝与镀层的结合强度可以达到22MPa。

Abstract:

Metallization is necessary for some packaging substrates. It is the key of metallization to improve the adhesion strength between copper plate and ceramic substrates. The adhesion between copper plate and ceramic substrates generally should be more than 15 MPa. Electroplated copper on alumina and aluminum nitride substrates has been studied. It is found that the roughening surface of the substrates can improve the adhesion. The technology of depositing copper plate and the testing methods of adhesion are also studied.