Si3N4／Cu68Ti20Ni12的界面结构及连接强度

Investigation on the Interface Structure and Joining Strength of Si3N4 / Cu68Ti20Ni12

摘要:

采用Cu68Ti20Ni12钎料进行了Si3N4／Si3N4的活性钎焊连接。结果表明：钎焊温度和时间对连接强度有重要影响；在1373K，10min的连接条件下，Si3N4/Si3N4连接强度达到最大值289MPa。通过对Si3N4／Cu68Ti20Ni12界面区的微观分析：发现Ti，Ni明显向Si3N4方向富集，相对Ni而言，Ti的富集区更靠近Si3N4陶瓷，而Si则向钎料方向扩散，Cu在接头中心富集：界面区存在2层反应层，反应层Ⅰ为TiN层，而反应层Ⅱ则由TiN，Ti5Si4，Ti5Si3，Ni3Si及NiTi化合物组成。

Abstract:

Joining of Si3N4 / Si3N4 was carried out by using Cu68Ti20Ni12 fill metal. The results show that brazing temperature and holding time have an important influence on joining strength, and the highest strength value (289 MPa) was achieved at the brazing temperature of 1 373 K for 10 minutes. Microanalysis of the Si3N4/ Cu68Ti20Ni12 interfacial region showthat Ti and Ni concentrate towards Si3N4 and the enriched area of Ti is closer to Si3N4 ceramics, while Si diffuses towards braze layer and Cu element is concentrated in the center part of the joint; Interfacial region has two reaction layer. Reaction layer I is TiN while reaction layer II consists of TiN, Ti5Si4, Ti5Si3, Ni3Si and NiTi compounds .