工艺条件对电沉积Ni-W合金纳米晶的影响

Influence of Technic Process on the Electrode position Ni-W Alloy Nanocrystalline

摘要:

选择对Ni-W合金电沉积影响较大的钨酸钠浓度、电流密度、镀液pH值、温度等4个工艺参数进行对比实验，探索了各因素对沉积速率、显微硬度、镀层外观的影响，为制备Ni-W合金纳米晶提供依据，同时制备出了晶粒尺寸为10．09nm的Ni-W合金纳米晶镀层。

Abstract:

A contrastive experiment was conducted by using 4 key process parameters, i.e. concentration of sodium tungstate, current density, pH value and temperature that have greater influences on the electro deposition of Ni-W alloy nanocrystalline. Influences on the deposition rate, microhardness and surface of plating were studied respectively, which would provide basis for the preparation of Ni-W alloy nanocrystalline. At the same time, the plating of Ni-W alloy nanocrystalline was obtained, the size of which was10.09 nm.