直接电镀用胶体钯催化剂的研制及性能

Preparation and Properties of Pd Colloids Catalyst for Direct Copper Plating

摘要:

ABS塑料直接电镀过程省略了化学镀，是塑料电镀史上的重大突破。只有制备出高分散性、粒度小的胶体催化剂，才可以成功实施直接电镀。采用液相还原法制备了几种不同分散性的催化剂，并采用紫外．可见吸收光谱（UV-VIS）、纳米粒度分析仪和立体显微镜来表征不同分散性的胶体钯溶液。分散性好的胶体钯溶液的紫外．可见吸收峰变宽，经过活化可以进行直接电镀。香草醛加入到胶体钯溶液中可以提高分散性和减小胶体粒度。

Abstract:

It is well known that direct copper plating on ABS plastics has found widely industrial application for eliminating plating. The Pd/Sn colloids for direct copper plating have better dispersivity and smaller size than the colloids for electroless electroless Ultraviolet-visible absorption spectrometry, nanophox, and stereoscopic microscopy were used to characterize the colloids. The good dispersivity colloids have excellent catalysis for direct copper plating and its UV-VIS peaks are broadened. In order to enhance the dispersivity and minimize the particle size, vanillin was added to colloids solution in the present investigation.