钨粉化学镀铜对W／15Cu电子封装材料性能的影响

Effects of Chemical Copperplated W Powder on Properties of W/15Cu Composite

摘要:

采用化学镀铜的方法在钨粉中加入诱导铜，经压型，熔渗后制成W／15Cu合金。用扫描电镜研究了材料的显微结构，并测出合金样品的密度、气密性、热膨胀系数等物理性能，通过与传统工艺制备的W／15Cu合金的显微组织以及物理性能方面做比较，讨论了钨粉化学镀铜对W／15Cu合金性能的影响。结果表明，钨粉化学镀铜对于提高钨生坯成形性能、改善钨铜复合材料的显微组织结构、提高材料物理性能方面都有很大作用。经过综合比较，镀铜含量以2％为宜。

Abstract:

Copper was induced into W powder by electroless, The compacts made from chemical copperplated W powder were infiltrated, and W/15 Cu composites were prepared. The microstructures of the composites were investigated by mean of scanning electron microscope Density, hermeticity and coefficient of thermal expansion were measured. After comparing microstructures and physical property of the W/15Cu made by conventional process, the effects of chemical copperplated W powder on properties of W/15Cu were discussed. The results showed that chemical copperplated W powder could improve the compactibility of W compact, the microstructure and the physical properties of W/15Cu composite. It is indicated that when the compact contains 2% copper, the properties of the material are fairly satisfactory.