电场和元素Cr对Cu／W润湿性的影响

Effects of Chromium and Electrical Field on Wettability between Copper and Tungsten

摘要:

在一特制的可施加电场的单管熔化炉内，借助DIGIDROPDGD-DS接触角测试仪研究了元素Cr和电场对Cu／W之间润湿性的影响。结果表明：元素Cr是Cu-W熔渗体系很好的助熔渗元素，在Cu中添加元素Cr可以显著减小Cu／W之间的接触角：外加电场也可以减小Cu／W之间的接触角，在实验的电场强度内，其减小的程度不及元素Cr明显。

Abstract:

A special furnace was designed and applied to produce an external electrical field up to 4 kV/cm and to study the wettability between copper and tungsten. The results showed that chromium can significantly reduce the wetting angle between copper and tungsten, so benefit to Cu-W infiltration system. The electrical field can also reduce the wetting angle, but not so stronger by comparing with chromium in the experimental electrical field range.