烧结熔渗过程中W和Ti扩散溶解的研究

Diffusion of W and Ti during Sintering and Infiltration

摘要:

利用扫描电镜(SEM)、能谱(EDS)和X射线衍射(XRD)分析W和Ti熔渗烧结合金的微观组织形貌和相结构；利用原子相图(TFDC)讨论W-Ti固溶体的形成机制、计算该固溶体的电子密度。结果表明，W骨架在1750 ℃熔渗Ti的过程中，Ti和W可发生互溶，形成置换固溶体TixW1-x。这种固溶体的HV0.1为3350~5280 MPa，电子密度为2.4851×1029个/m3，计算其点阵常数为0.3140 nm

Abstract:

The microstructure of W and Ti alloy prepared by sintering and infiltration has been studied. The formation mechanism of W-Ti solid solution is discussed and the electron density of W-Ti solid solution is calculated by means of the Thomas-Fermi-Dirac-Cheng phase diagram (TFDC). The results show that the substitutional solid solution of TixW1-x results from the W and Ti atoms diffusing into each other during sintering and infiltration at 1750 ℃. The hardness value range of this solid solution is 3350～5280 MPa (HV0.1). The electron density of W-Ti solid solution is 2.4851×1029 /m3 and the calculated lattice parameter is 0.3140 nm