SnAgCu系无铅钎料合金力学性能及钎焊性能研究

Study on Mechanical Property and Solder ability of SnAgCu System Lead-free Solder Alloy

摘要:

利用光学显微镜、扫描电子显微镜（SEM）和能谱分析仪(EDX)及Instron电液伺服疲劳拉伸试验机，对SnAgCu系无铅钎料合金的力学性能和钎焊性能进行了研究。结果表明，适量的稀土元素Ce的添加显著地延长了Sn3Ag2.8Cu钎焊接头在室温下的蠕变断裂寿命，Sn3Ag2.8Cu-0.1Ce钎焊接头的蠕变断裂寿命超过Sn3Ag2.8Cu钎料的9倍；同时，使Sn3Ag2.8Cu合金的延伸性能也得到了显著改善，伸长率达到15.7%；Sn3Ag2.8Cu-0.1Ce与铜基板的扩散层厚度比Sn37Pb厚，但是比S

Abstract:

The mechanical property and solder ability of SnAgCu system lead-free solder alloys were studied by means of optical microscopy, scanning electron microscopy(SEM), energy dispersive X-ray(EDX) and Instron electrohydraulic servo fatigue tensile tester. The results indicate that proper quantities of Ce can remarkably prolong the creep-rupture life of the Sn3Ag2.8Cu brazing joint at room temperature, and the creep-rupture life of the Sn3Ag2.8Cu-0.1Ce brazing joint is 9 times or more than that of the Sn3Ag2.8Cu; meanwhile, the elongation of the Sn3.0Ag2.8Cu-0.1Ce solder alloy is also obviously improved even up to 15.7%; the intermetallic layers of the Sn3Ag2.8Cu-0.1Ce with copper plate are thicker than that of Sn37Pb, but thinner than that of Sn3Ag2.8Cu.