高强高导铜铌微观复合材料的微观结构与性能

Microstructure and Properties of High Strength and High Conductivity Cu-Nb Microcomposite

摘要:

采用集束拉拔制备技术获得了含有N=854铌芯的Cu-Nb微观复合材料。在77 K条件下材料的电阻率为0.36 μΩ·cm，在293 K时，复合材料导电率大于70%IACS。复合材料截面面积大于5 mm2时，复合材料室温抗拉强度达到915 MPa。通过扫描电镜观察了材料拉伸断口形貌及芯丝排布情况。

Abstract:

Cu-Nb microcomposite wire materials containing N=854 niobium filaments were prepared by bundling and drawing technique. The electrical resistivity of the materials is 0.36 μΩ·cm at 77 K. The conductivity values could be greater than 70%IACS at 293 K. The ultimate tensile strength could reach 915 MPa at room temperature when the sectional area of the materials was larger than 5 mm2. And the fracture surface morphology and the Nb filaments arrangement of Cu-Nb wires were observed by SEM.