AlN/Mo-Ni-Cu的活性封接研究

Study on Active Brazing of AlN Ceramics and Mo-Ni-Cu Alloy

摘要:

采用Ag70-Cu28-Ti2活性焊料在真空条件下对AlN陶瓷和Mo-Ni-Cu合金进行活性封焊。分析焊区的显微组织形态、相组成，测定焊区力学性能和气密性。结果表明：在焊料层与合金的界面处Cu的含量相对较高，而在AlN陶瓷与焊料层的界面处形成了厚度为1~2 μm的富Ti层；经XRD分析发现，AlN陶瓷与焊料层的界面上有TiN存在，表明在AlN陶瓷与焊料层的界面处形成了化学键合。焊接后试样的气密性达到1.0×10-11 Pa·m3/s，抗弯强度σb=78.55 MPa，剪切强度στ=189.58 MPa。

Abstract:

AlN ceramics and Mo-Ni-Cu alloy were brazed actively by Ag70-Cu28-Ti2 active solder in vacuum. The microstructure and phase composition of the brazed zone were analyzed and its mechanical properties and gas leakage were tested. Results show that Cu content is relatively high in the interface between the solder layer and the alloy; while Ti-rich layer with 1-2 μm thickness forms in the interface between the solder layer and AlN ceramics, where TiN is found by XRD, which indicates that there is chemical bonding in the AlN-solder interface. The gas leakage rate of the sample was 1.0 ×10-11 Pa·m3/s, and the bending strength and shear strength were σｂ=78.55 MPa, and στ=189.58 MP, respectively.