“十一五”总装备部预研项目(51323060305);信息产业部电子第五研究所科技发展基金(XF0726130)
陆裕东,何小琦,恩云飞,王 歆,庄志强. Ni/Au镀层与SnPb焊点界面电迁移的极性效应[J].稀有金属材料与工程,2010,39(2):254~257.[Lu Yudong, He Xiaoqi, En Yunfei, Wang Xin, Zhuang Zhiqiang. Polarity of Electromigration at the Interface between SnPb Solder Joints and Ni/Au Finishes[J]. Rare Metal Materials and Engineering,2010,39(2):254~257.]
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