靶材用钨铜复合材料的制备工艺

Fabrication Technology of Tungsten Copper Composite for Sputtering Material

摘要:

在真空条件下，采用高温烧结钨骨架后渗铜工艺制备靶材用钨铜复合材料，研究烧结温度对钨坯及钨铜复合材料组织与性能的影响。结果表明：随着烧结温度的提高，钨颗粒间逐渐由点接触扩大为面接触，烧结颈逐渐长大，同时孔隙不断缩小并趋于球形，钨骨架和钨铜复合材料相对密度及硬度不断增加，而钨铜复合材料的电导率不断下降。当烧结温度为1950 ℃时，钨骨架和钨铜复合材料的相对密度分别达到74.8%和96.9%的最高值；钨铜复合材料的硬度（HB）达最大值2520 MPa，而电导率则降低到36.6IACS%，其中氧含量仅为4×10-6，氮含量为3×10-6。

Abstract:

Tungsten copper composite for sputtering materials was fabricated by sintering a tungsten skeleton at high temperature under the vacuum condition followed by infiltration of copper. The effect of sintering temperature on microstructures and properties of the tungsten skeleton and the tungsten copper composite were investigated. The results show that with increasing of the sintering temperature, the point touch becomes face touch between tungsten particles; the sintering necks grow and the pores reduce to sphericity gradually. Meanwhile, the relative density and hardness of the tungsten skeleton and the tungsten copper composite increase constantly and the electric conductivity of the composite decreases correspondingly. When sintered at 1950 oC, the relative density of the tungsten skeleton and the tungsten copper composite reaches the maximum of 74.8% and 96.9%, respectively; the hardness (HB) of the tungsten copper composite gets the maximum of 2520 MPa, while its electrical conductivity reduces to 36.6IACS%; moreover, its oxygen content is only 4×10-6 and the nitrogen content is 3×10-6.