Mo-30Cu合金的组织与性能

Microstructures and Properties of Mo-30Cu Alloy

摘要:

采用液相烧结法制备出Mo-30Cu合金，利用XRD，SEM，TEM等对该合金的组织进行分析观察，并研究烧结温度、相对密度对Mo-30Cu合金组织性能的影响。结果表明：该合金组织分布均匀，组织中只含有Mo、Cu两相，在两相之间有一Mo、Cu互溶区；烧结温度是影响Mo-30Cu性能的最重要因素，在1300 ℃烧结的合金相对密度为99.6%，热导率为196 W·(m·K)-1

Abstract:

Mo-30Cu alloy was prepared by liquid sintering. Microstructures and composition of the alloy were analyzed with SEM, TEM and XRD, and the influence of sintering temperatures and relative density on microstructures and properties of the alloy was studied. The results indicate that the microstructure of the Mo-30Cu alloy is homogeneous, in which are only Mo phase and Cu phase for the alloy; a medium changing zone is between Mo phase and Cu phase. The sintering temperature plays the most important role on the microstructures and properties of the alloy. Relative density and thermal conductivity of Mo-30Cu alloy sintered at 1300 oC are 99.6% and 196 W·(m·K)-1, respectively