纳米Ag颗粒增强复合钎料蠕变性能的研究

Creep Properties of Ag Nanoparticle Reinforced Sn-Cu Composite Solders

摘要:

制备纳米Ag颗粒增强的Sn-Cu基复合钎料。研究不同温度载荷下复合钎料钎焊接头的蠕变断裂寿命，并与Sn-0.7Cu基体钎料钎焊接头进行对比。此外，确定纳米Ag颗粒增强的Sn-Cu基复合钎料钎焊接头在不同温度和应力水平下的应力指数和蠕变激活能，建立复合钎料钎焊接头的稳态蠕变本构方程。结果表明，在不同的温度和应力下，与Sn-0.7Cu钎料钎焊接头相比，纳米Ag颗粒增强的Sn-Cu基复合钎料钎焊接头的蠕变断裂寿命均有所提高，且具有更高的蠕变激活能，说明复合钎料钎焊接头具有更优的抗蠕变性能

Abstract:

Reinforced Ag nanoparticles were incorporated into Sn-0.7Cu matrix composite solder by a mechanical means in order to improve the creep properties of the solder matrix. The creep-rupture life was studied of Sn-0.7Cu solder joints and composite solder joints reinforced with Ag nanoparticles at different temperatures and applied stresses. Stress exponents and creep activation energy were calculated for Ag nanoparticle reinforced Sn-Cu matrix composite solder joints at different temperatures and stress levels. Steady-state creep constitutive equation of the composite solder joint was established. Results show that at different temperatures and stresses, Ag nanoparticles reinforced Sn-Cu composite solder joints have higher creep rupture life and creep activation energy than Sn-0.7Cu solder joints. It indicates the creep resistance of the composite solder joint with 1 vol% Ag reinforcement addition is better than that of Sn-0.7Cu solder joint