复烧对Mo-15Cu薄板组织和物理性能的影响

摘要:

对相对密度为90.5%的Mo-15Cu薄板分别进行70%、90%冷轧变形，随后在1200 ℃保温1或1.5 h进行复烧处理。观察复烧前后的显微组织变化，并测定70%变形量板材复烧前后的XRD图谱、热导率、电阻率以及线膨胀系数。通过分析发现，复烧后大量地消除Mo-15Cu薄板的组织缺陷，70%变形量板材复烧后的热导率为154.5 W·(m·K)-1，电阻率为4.48 μΩ·cm，线膨胀系数为6.31×10-6 K-1。结果表明，复烧工艺可以极大地改善Mo-15Cu冷轧薄板的组织和物理性能，使其能够达到作为电子封装材料的要求

Abstract:

Mo-15Cu sheets of 90.5% relative density were cold-rolled with deformation by 70% and 90% and then resintered at 1200 oC for 1 and 1.5 h. The microstructure change and XRD patterns of the sheets before and after resintering were analyzed. The thermal conductivity, electrical resistivity and thermal expansion coefficient of the sheets rolled and sintered were measured. Results show that the microstructure defects of the cold-rolled sheets were eliminated significantly by resintering. The thermal conductivity of 70% deformed sheet after resintering was 154.5 W(m·K)-1, electrical resistivity was 4.48 μΩ·cm, and the thermal expansion coefficient was 6.31×10-6 K–1. It is concluded that the resintering technology can improve greatly the microstructure and physical performances of cold-rolled Mo-15Cu sheets to meet the demands of electronic packaging materials