不同成分无铅焊锡粉末特性研究

Study on Properties of Lead-Free Solder Powder with Different Composition

摘要:

利用自行设计的超音速雾化制粉装置制备了无铅焊锡合金粉。研究了不同成分对雾化粉末特性的影响，同时观察了无铅焊锡雾化粉末钎焊接头的组织，并与传统含铅合金做了对比。结果表明：在相同过热度下，在3种不同成分的粉末中，Sn3Ag2.8Cu粉末具有最高的有效雾化率、最低的氧含量、最好的球形度和最光滑的表面；Sn3Ag2.8Cu焊锡膏与铜基板形成的扩散层比Sn3Ag2.8Cu-0.1Ce和Sn37Pb焊锡膏与铜基板的扩散层更厚，且形成的金属间化合物更不规则；Sn3Ag2.8Cu-0.1Ce粉末有效雾化率和氧含量均高于Sn37Pb

Abstract:

Lead-free solder powder of Sn-Ag-Cu system was prepared with a supersonic atomizer designed by ourselves. Then the effects of different compositions on the properties of the powder were studied, and the microstructure of its brazed joint was observed, which was compared with that of Sn37Pb solder powder. The results show that the Sn3Ag2.8Cu powder has the highest effective atomization efficiency, the lowest oxygen content, the best sphericity and surface smoothness in the three different compositions powders under the same superheat; the diffusion layer formed between Sn3Ag2.8Cu soldering paste and the copper substrate is thicker and their intermetallics are more irregular than those of Sn37Pb and Sn3Ag2.8Cu-0.1Ce soldering paste; the Sn3Ag2.8Cu-0.1Ce powder has higher effective atomization efficiency and oxygen content than the Sn37Pb powder