离子掩蔽剂在制备铜银双金属粉中的应用

Ionic Masking Agent in the Preparation of Copper-Silver Bimetallic Powder

摘要:

采用化学置换法制备了系列铜银双金属粉，在制备过程中添加离子掩蔽剂，有效消除了铜氨络合离子在铜粉表面的吸附，实现银在铜粉表面的连续包覆。分析了掩蔽原理及其主要影响因素，并用透射电子显微镜，热重分析仪，X射线衍射仪对铜银双金属粉进行了表征。结果表明：在添加了离子掩蔽剂后制备铜银双金属粉末为连续包覆型结构，分散性好，有效改善了铜粉的抗氧化性能

Abstract:

A series of copper-silver bimetallic powder was prepared by a chemical replacement method. In this process, ionic masking agent was added to eliminate copper ammonia complex ions adsorption on copper powder surface, which realizes silver continuous coating on the copper powder surfaces. The masking mechanism and the main influencing factors were analyzed. Besides that, TEM, TGA and XRD were used to characterize the Cu-Ag bimetallic powder. Results show that the copper-silver bimetallic powder with the ionic masking agent is of a continuous coating type structure, which has good dispersity, effectively improving antioxidation properties of the copper powder.