MEMS微器件电沉积层均匀性的研究进展

Research Progress on Uniformity of MEMS Micro-Device Electrodeposition

摘要:

有效地改善沉积层厚度均匀性是电化学沉积技术应用的关键，简述了微电铸原理，综述了国内外微器件沉积层均匀性的最新研究进展，包括优化工艺参数、脉冲电流与换向脉冲电流、改善传质条件、辅助阴极、阴极屏蔽、阳极特性及数值模拟仿真技术改善沉积层均匀性的研究报道，详细介绍了超临界CO2电化学沉积新方法及其优点，并展望了今后的研究重点及发展方向。

Abstract:

The ability to control the uniformity of electrodeposition is the key to successful application of electrodeposition technology such as electroplating and electroforming. The principle of micro-electroforming is briefly introduced. The latest research progresses of the thickness uniformity of micro-device electrodeposition at home and abroad are summarized, including optimization of parameters in electrodeposition, modification of current density and application of modulated current, metal ion transportation, auxiliary cathode, shields and baffles, careful control of anode properties, numerical simulation. A new electroplating method in supercritical carbon dioxide and its advantages are presented in detail. Finally, the research focus and future aspects about the uniformity are proposed.