印刷电路板上化学镀钯工艺研究

Study on Compound Complexant of Electroless Palladium in Printed Circuit Board

摘要:

采用L9(34) 混合正交体系，系统地研究复合络合剂-乙二胺、乙二胺四乙酸二钠和丙烯酸在不同工艺参数和不同添加配比情况下对化学镀钯质量的影响，以镀层的光亮度，镀液的稳定性和沉积速度为评价指标，筛选出最佳的化学镀钯添加剂为：乙二胺0.2 mol/L，乙二胺四乙酸二钠0.01 mol/L，丙烯酸0.3 mol/L，pH值8。研究结果表明，优化后的化学镀钯镀液稳定性高、沉积速度快、钯膜与基体镍镀层结合力强、钯镀层光亮性好

Abstract:

The influences of the process parameters and the concentration of the compound complexant consisting of ethylenediamine, ethylenediaminetetraacetic acid disodium salt (EDTA-2Na) and acrylic acid on the quality of electroless palladium (Pd) were studied using L9(34) orthogonal table. The brightness of Pd coating, the bath stability and the plating speed were taken as assessment standard. The results show that the optimized bath of the electroless Pd is possessed of good stability and high depositing rate. The binding force between Pd film and Ni coating is strong, and Pd film surface is bright. The optimized concentration of ethylenediamine is 0.2 mol/L, EDTA-2Na was 0.01 mol/L, acrylic acid was 0.3 mol/L and pH was 8