Cu/WCu/Cu复合薄板的组织和性能研究

Investigation of Microstructure and Properties of Cu/WCu/Cu Thin Sheet

摘要:

为减少传统工艺制备的钨/铜薄板在压力加工过程中产生过多缺陷，提高板材的力学和电学性能，设计了一种新型的具有Cu/WCu/Cu三明治结构的超薄板，对比分析了两种结构板材在轧制过程中组织和性能的变化。结果表明：与传统结构试样相比，三明治结构试样表面覆铜层能够完成对基体表层钨颗粒的包覆和孔隙的填充，进而实现表面改性；三明治结构试样在轧制过程中产生缺陷相对较少，加工硬化不明显，抗拉强度和导电性能也优于传统试样。

Abstract:

In order to reduce defects and improve the mechanical and electrical properties of W-Cu thin sheet under pressure process, a new Cu/WCu/Cu ultra-thin sheet with three-layer sandwich structure was designed, and then the changes of microstructures and properties of two structure specimens in cold-rolling process were compared and analyzed. The results show that compared with conventional structure specimens, the surface Cu-coated layer of the sandwich structure specimen can clad the tungsten particles and fill the pores on the surface of the substrate, thus achieve surface modification; in rolling process, sandwich structure specimens have relatively fewer defects, and working hardening is not obvious, the tensile strength and electrical conductivity are better than that of conventional structure specimens.