Vacuum Diffusion Bonding and Interfacial Structure in Ta/Cu Couple

摘要:

研究了工艺参数对Ta/Cu真空扩散焊的影响。利用扫描电镜（SEM）、能谱分析（EDS）、显微硬度等测试方法对结合面微区进行了分析。结果表明：采用真空扩散焊工艺，在焊接压力为10 MPa及焊接时间为60 min的工艺参数下，界面孔洞随着焊接温度的升高而减少，在焊接温度达到1000 °C时，结合面内孔洞基本消失，结合面扩散区域宽度为3~5 μm；加工硬化导致硬度升高，焊合区的硬度值要比未焊合区的硬度值稍高

Abstract:

The effects of process parameters on vacuum diffusion bonding between tantalum (Ta) and copper (Cu) were studied. The interfacial structure of Ta/Cu joint was analyzed by scanning electron microscopy (SEM), energy dispersive spectrometer (EDS) and microhardness test. The results indicate that under the condition of loading pressure of 10 MPa and holding time of 60 min, the number of interfacial voids decreases with increasing of bonding temperature. With the temperature up to 1000 °C, the voids at the interface disappear completely, the joint has the maximum shear strength, and its interfacial layer is about 3 to 5 μm. The microhardness test shows that the hardness in weld zone is relatively higher than that in non-weld zone due to the fact that work hardening takes place in the matrix and the joint interface