不同形状钨粉化学镀铜的研究

Copper Coated Tungsten Powders with Different Shapes Made by Electroless Plating

摘要:

通过化学镀法制备铜包钨复合粉末，研究不规则形状的钨粉以及经等离子球化处理的球形钨粉的化学镀铜。结果表明，对于颗粒形貌不规则棱角分明的破碎钨粉，经化学镀包覆后粉末没有明显的棱角，表面粗糙。而经等离子球化处理后球形度较高的球形粉，颗粒表面存在缺陷，化学镀后粉末的球形度没有明显的变化，化学镀层在其表面沉积均匀，且钨粉表面质量得到改善，不存在表面缺陷。化学镀后复合粉末在600 ℃下进行氢气退火处理后，镀层上的粗糙的表面变得平滑，镀层中的空隙明显减少，形成了一层均匀致密的铜层包覆在钨颗粒表面。

Abstract:

Copper coated tungsten composite powders were prepared by an electroless plating method. The electroless plating of copper on tungsten powders with an irregular shape and a spherical shape was studied. The spherical shape of tungsten powder was made by a radio frequency plasma process. For the particles of irregular and angular shape, there is no obvious edge after plating and their surface becomes rough. But for spherical particles with surface defects, they become surface-round and the spherical degree has no obvious change because copper is deposited uniformly on the particle surface in the electroless plating process. Thus, the surface quality of tungsten powder is improved and the surface defect is eliminated. After annealing in hydrogen at 600 oC, the surface of copper coated tungsten becomes smooth, and the pores in the coated layer are decreased obviously. Finally, a compact layer of copper is coated on the surface of tungsten powder to form a W-Cu composite powder.