表面活性剂对镀Ti金刚石-Ni复合电沉积行为的影响

Effect of surfactant on coelectrodeposition behavior of Ti-coated diamond-Ni composit

摘要:

本文研究了阴离子表面活性剂十二烷基硫酸钠（SDS, Sodium dodecyl sulfate）和阳离子表面活性剂十六烷基三甲基溴化铵（CTAB, Cetyltrimethyl ammonium bromide）对镀Ti金刚石-Ni复合电沉积的影响，并结合循环伏安、交流阻抗等电化学方法研究了镀Ti金刚石-Ni镀液中Ni电沉积过程。结果表明：与未镀覆金刚石相比，镀Ti金刚石与Ni层浸润性得到提高。浓度为0.05g/L的SDS对Ni电结晶过程有抑制作用，而浓度为0.05g/L的CTAB能促进Ni2 离子转移并加快Ni的电沉积过程。SDS和CTAB都能促进电沉积过程中氢气的析出并细化Ni镀层，同时减少镀层针孔和凹痕。

Abstract:

The effects of anionic surfactant (sodium dodecyl sulfate, SDS) and cationic surfactant (cetyl trimethyl ammonium bromide, CTAB) on the coelectrodeposition of Ti-coated diamond-Ni composite plating are studied in this paper. The electrolytic deposition behaviour of nickel is investigated using cyclic voltammetry (CV) and electrochemical impedance spectroscopy (EIS). The results indicate that the diamond coated with Ti exhibits better infiltration when contact with Ni plating in contrast with that without Ti coating. The SDS with a concentration of 0.05 g/L inhibits the electrolytic deposition of Ni. While the CTAB with a concentration of 0.05 g/L promotes the transfer of Ni2 ions and accelerates the electrolytic deposition of Ni. The addition of SDS and CTAB refines the Ni coating and favours the evolution of hydrogen in the course of electrolytic deposition. Moreover,SDS and CTAB both decreases the numbers of pinhole and pitting in the coating.