化学镀和粉末冶金法制备W/Cu梯度热沉材料

Fabrication of W/Cu graded heat-sink materials by electroless plating and powder metall

摘要:

用化学镀法和粉末冶金的方法制备高致密的W/Cu梯度热沉材料。用场发射扫描电镜观察了材料的组织结构、界面和断口形貌。对材料的机械性能也进行了表征，如抗弯强度和显微硬度。结果表明材料每一层都很致密且组织结构均匀。从截面上材料成分呈梯度分布，每层之间没有明显的界面。三层W/Cu梯度热沉材料的相对密度可达99.2%。散热层、过渡层和封接层的显微硬度值分别是200、210和240 HV。抗弯实验结果所示封接层和散热层作为承重抗弯表面时的抗弯强度分别是428.5MPa和480.7MPa。

Abstract:

The W/Cu graded heat-sink materials with high density were fabricated by electroless plating and powder metallurgy. The microstructure, interface and fracture of the graded heat-sink materials were observed using the field emission scanning electron microscope (FESEM). The mechanical properties of the materials such as bending strength and hardness were determined. The experimental results showed that the structure of each layer was uniform and dense. The components of the cross-section presented a graded distribution. There was no obvious interface among layers. The relative density of three-layer W/Cu graded heat-sink materials reached 99.2%. The average values of microhardness of radiating layer, transitional layer and sealing layer were HV200, 210 and 240, respectively. It is indicated through the experimental results of bending strength that the bending strengths of the sealing layer and the radiating layer as the load-bearing surfaces were 428.5 MPa and 480.7MPa, respectively.