CLAM钢表面室温离子液体电镀铝

Electroplating of CLAM Steel by Aluminum in Ambient Temperature Chloroaluminate ionic liquids

摘要:

采用AlCl3-EMIC离子液体在室温下对国产低活性铁素体/马氏体钢（CLAM钢）表面进行镀铝处理，研究了镀前处理对镀层－基体界面的影响，采用SEM、EDS分析了不同电流密度对镀层表面形貌与界面形貌的影响，同时与脉冲电镀所得结果进行了比较。结果表明：在电化学前处理过程中，增大电流密度会增强镀层与基底结合力；电流脉冲的加入可以减弱溶液浓差极化现象，增加表面组织致密性；镀层晶粒大小随电流密度增大而减小，镀层球状组织随电流密度增大而增大。在优化的电镀工艺下（前处理电流密度控制在10mA/cm2以上，电镀电流密度控制在10~20 mA /cm2，对应的电镀时间45~95 min，优选脉冲电流电镀），得到的铝镀层表面光滑，致密，结合力强，厚度可控。

Abstract:

To fabricate tritium penetration barrier of aluminizing coating on Chinese low active martensite (CLAM) steel, electroplating of aluminum on CLAM steel from ambient temperature chloroaluminate ionic liquid AlCl3-MEIC（AlCl3-1-ethyl-3-methylimidazolium chloride） was carried out. The adhesion of substrates and aluminum coating at different pretreatment of the substrates was examined. The surface morphology,crystal size of aluminum coating at different current densities were examined by SEM and EDS. Comparing the surface morphology of aluminum plated by direct current process with which plated by pulse current process. The results show that the electroplating of aluminum on CLAM steel from AlCl3-MEIC is feasible. The current density of electrical pretreatment has influenced to the adhesion of substrates and aluminum coating. Increasing the current density can improve the adherence of substrates and aluminum coating. Using pulse current plating process can improve the compactness of surface morphology. Particle size of aluminum coating decreases with increasing current density. Spherical structure of aluminum coating increases with increasing current density. The deposited aluminum coating is whiter, smooth and uniform at preferable plating techniques. The preferable range of current density is 10～20 mA/cm2.The range of electroplating time is 45~95 min. The pulse current process is better.