Characterization of Al/Ni Nanoscale Multilayer Used for Transient-Liquid-Phase Bonding of Copper and Al2O3 Ceramic

摘要:

研究制备系列具有不同调制周期的Al-Ni多层膜，并将其应用于铜与氧化铝陶瓷件的TLP（transient-liquid-phase，瞬间液相）连接。分别对制备的系列多层膜及金属陶瓷接头微观组织进行表征，同时采用DSC及XRD对反应多层膜反应特性进行研究。研究结果表明，采用Al/Ni微纳尺度多层膜不仅可降低铜与氧化铝连接温度，并能提高焊接接头质量

Abstract:

A series of Al-Ni reactive multilayer with different modulation periods were fabricated by DC magnetron sputtering process, and transient-liquid-phase (TLP) bonding of copper and Al2O3 ceramic was carried out by the multilayer foils. The microstructure of the as-deposited foils and the cermet joint were investigated. The reaction behaviors of Al/Ni multilayers were characterized by means of DSC and X-ray diffraction. The results show that the application of Al/Ni multilayer foils not only decreases the joining temperature of the copper and Al2O3 ceramic, but also improves the quality of the joint