Structural View Study on Diamond and Copper Bonding with AlNi Micro/nano Multilayers

摘要:

研究涉及新型金刚石热沉与LED芯片铜组件的高导热连接问题。制备和分析了AlNi微纳多层膜，并将其应用于金刚石和铜组件进行自蔓延连接。热分析和显微组织观察结果表明双金属层（Al/Ni多层膜结构中Al层和Ni层交替一次的双层厚度）显著影响自蔓延反应放热，同时对稳定和控制焊接工艺有重要作用；进而讨论了钒元素添加和电磁致导磁效应与微纳多层膜结构和双金属层的关系；最终接头质量检测表明，微纳多层膜自蔓延法焊接的接头质量优于现用银胶连接

Abstract:

A novel high thermal conductivity joining between diamond heat sink and light emitting diode (LED) chip was investigated. AlNi nano/micro-multilayers were fabricated and used to test the bonding of copper and diamond by self-propagation. The thermal analysis results and micro structure observation show that the bilayer (one alternative sputtering period of aluminium and nickel layers) of the mulilayer will influence the heat release of propagation reaction, and hence help to control the bonding process with steady. The influence of the vanadium addition and the magneto-conductivity of nickel element on the structures of the multilyers were also discussed, which has relation with the bilayer either. The quality of the diamond-copper joint by nano-multilayer bonding is better than that of the silver glue bonding in shearing strength and thermal conductivity