Interfacial Reaction Kinetics between Liquid Sn-Ag-Cu Alloys and Cu Substrate

摘要:

利用静滴法研究了Sn-Cu-Ag/Cu体系熔融焊料的润湿机理，结果发现，700 K是合金焊料铺展机理的转折点。利用DTA分析方法研究了界面反应，采用Kissinger方法计算了界面反应热动力学参数，另外，还研究了元素Cu对提高Sn-Ag-Cu/Cu体系界面反应活化能的影响及对界面反应速率的抑制作用。

Abstract:

The sessile drop method was used in the present experiment to study the spreading wetting principle. It is found that 700 K is an important point for the spreading mechanism of the alloy. DTA (Differential Thermal Analysis) was used to analyze the interfacial reaction and the Kissinger method was used to calculate the reaction thermo-kinetics parameters. In addition, it was investigated that element Cu improved the activation energy of Sn-Ag-Cu/Cu system, and suppressed interface reaction rate.