Direct Electrodeposition of Fe-Ni Alloy Films on Silicon Substrate

摘要:

在n-型Si片 (100) 面上直接电沉积Fe-Ni合金薄膜，并对电沉积过程特征及薄膜的结构和性能进行了研究。当阴极电流密度高于1.0 A/dm2时，可获得连续致密的合金薄膜，且电沉积表现为异常共沉积过程。在1.0~4.0 A/dm2 范围内改变电流密度可调控合金薄膜的Ni质量分数从45%到78%之间改变，对应的电流效率在60%到66%之间变动。从XRD和TEM结果来看，合金薄膜由尺寸为 10~30 nm的纳米晶粒组成，且表现为Fe-Ni面心立方固溶体结构。合金薄膜的磁滞回线表现出较高的饱和磁化强度和接近于零的矫顽力，表明该种纳米合金薄膜具有很好的软磁性能。

Abstract:

The direct electroplating of Fe-Ni alloy films onto (100) n-type Si substrates were conducted. The electrodeposition phases, the film structure and the performance were investigated. The results show that when the current density is above 1.0 A/dm2, continuous films are formed and show an anomalous co-deposition progress occurs. When films are prepared with the current density from 1.0 to 4.0 A/dm2 the nickel composition can be adjusted from 45% to 78% (mass fraction), and the corresponding current efficiencies are from about 60% to 66%. The films consisting of 10~30 nm nanocrystallites show the fcc structure of solid solution of Fe-Ni. The magnetic hystersis loops of the alloy films exhibit a higher saturation magnetization and a very low coercive filed approaching zero, indicating that nanosized alloy films have very good soft magnetic performance.