高强高导Cu-Nb微观复合材料热稳定性

Thermal Stability of high strength and high conductivity Cu-Nb microcomposites

摘要:

通过集束拉拔技术制备了高强高导Cu-Nb微观复合材料，采用X射线衍射、扫描电镜等手段分析了不同热处理条件下材料晶体取向、界面结构的演变，通过应力应变曲线和电导测试研究了不同热处理条件对材料强度、电导的影响规律，结果表明：700℃热处理就可促使形成Cu、Nb的再结晶织构，由极塑变形所导致的区域化学势差异及原子扩散是影响Cu/Nb界面稳定性的关键因素；而700℃的中间热处理可以极大改善材料后续的加工塑性，同时在一定后续形变量条件下仍可获得高强度性能，而且通过低温调整热处理可改善材料导电性，同时保持较高强度。

Abstract:

High strength and high conductivity Cu-Nb microcomposites were fabricated by accumulated bundling and drawing process. The crystal orientation and morphology of Cu-Nb materials were investigated by means of X-ray diffraction and scanning electron microscopy. The stress-strain curves and conductivity of samples at different HT condition were measured. It is indicated that recrystallization textures are formed after HT at 700℃. Chemical potential difference and atomic diffusion caused by serve plastic deformation are key factors of interface stability. And even intermediate HT at 700℃ will be benefit for the mechanical properties of Cu-Nb microcomposites. It is believed that low temperature adjustment could improve the plasticity and keep the strength.