电子束物理气相沉积Cu-Mo复合材料微结构与性能

Microstructure and properties of Cu-Mo composites by EB-PVD

摘要:

本文采用电子束物理气相沉积（EB-PVD）制备了纳米钼颗粒弥散强化铜基复合材料（Mo体积含量为 2.5%-10.8%），对其材料微观结构、钼含量和硬度、电阻率关系进行了研究。结果表明：Cu-Mo复合材料基体由柱状晶铜组成，Mo颗粒平均直径为2.4-8.1nm；随着钼含量增加，铜基体柱状晶宽度逐渐减小，第二相Mo颗粒平均直径逐渐增加，硬度、电阻率逐渐增加；EB-PVD制备的Cu-Mo复合材料主要强化机制为Orowan机制。

Abstract:

Mo particle reinforced copper composites with Mo 2.5-10.8 vol% were prepared by Electron beam physical vapor deposition (EB-PVD), the microstructure, hardness and electrical resistivity were investigated. The results show that the Cu matrix is composed of columnar crystalline and the average grain size of Mo particle is 2.4-8.1nm; the columnar crystal width of copper matrix, hardness and electrical resistivity of the composites increase with the increase of the Mo content; the strengthening mechanism of the composites by EB-PVD is mainly the Orowan mechanism.