热等静压制备铜金刚石复合材料

Fabrication of Diamond/copper Composites by Hot Isostatic Pressing

摘要:

利用包套热等静压（HIP）烧结在900 ℃温度和110 MPa压力下烧结1 h实现了铜金刚石复合材料的制备，并对复合材料的显微结构和热学性能进行了研究，结果表明：该材料中金刚石分布均匀且未发生石墨化。随着金刚石体积分数的增加，复合材料的致密度、热导率与热膨胀系数下降。制得样品中的最高致密度和热导率分别为98.5%和305 W/mK。和热压烧结（HP）及放电等离子体烧结（SPS）相比，热等静压制得的铜金刚石复合材料的热导率达到相同水平甚至更高。可见，热等静压在制备铜金刚石复合材料上拥有很大潜力。

Abstract:

Diamond/copper composites were successfully fabricated by hot isostatic pressing(HIP) at a temperature of 900 ℃ and a pressure of 110 MPa for 1 h, and their microstructure and thermal properties were also studied. The results show that diamond particles are dispersed homogeneously in the copper matrix without evident graphitization. With increasing volume fraction of diamond, the relative density, thermal conductivity and coefficient of thermal expansion of the composites decrease. The maximum relative density and thermal conductivity of these samples are up to 98.5% and 305 W/mK, respectively. The diamond/copper composites prepared by HIP can achieve equal or even higher thermal conductivity than those fabricated by hot pressing(HP) and spark plasma sintering(SPS). Obviously, HIP shows great potential in preparing diamond/copper composites.