W/Cu梯度材料热应力分析及结构优化设计

Simulation of Thermal Stress and Optimization Design of Structure for the Tungsten/Copper Functional Gradient Material

摘要:

运用ANSYS12.0软件对W/Cu梯度材料进行热应力模拟分析，并对结构进行优化设计。结果表明，随着成分分布指数（p）的增加，最大热应力先减小后增大；在p=1.3，热流密度为30 MW/m2时，最大热应力值最小为180 MPa，与非梯度材料相比最大等效热应力降低79%；最优化的梯度层厚度大于3 mm，梯度层数4~6层，钨板的厚度1~3 mm。

Abstract:

Thermal stress and optimum structure design of tungsten/copper functional gradient materials (W/Cu FGM) were analyzed via ANSYS12.0 code. The results show that the maximum thermal stresses firstly decrease to a bottom value and then slightly increase with the increasing of compositional exponent (p) of W/Cu FGM. The equivalent Von Mises thermal stress for the W/Cu FGM (p=1.3) is 180 MPa, decreased by 79% compared with non-FGM under heat flux of 30 MW/m2. According to the simulation results, the optimal parameters of the W/Cu FGM are listed as following: above 3 mm for the thickness, 4~6 layer for the W/Cu FGM and 1 mm to 3 mm of the thickness for the tungsten layer.