Sn3.0Ag0.5Cu0.05Cr/Cu焊点界面IMC层热时效形貌及生长行为研究

Interfacial IMC Layer Morphology and Growth Behavior of Sn3.0Ag0.5Cu0.05Cr/Cu Solder Joints during Isothermal Aging

摘要:

研究了Sn3.0Ag0.5Cu0.05Cr焊料（SACCr）制成的Cu/Solder/Cu焊点在150 ℃时效0、168、500及1000 h下界面金属间化合物（IMC）层的形貌及生长行为，并与Sn3.0Ag0.5Cu（SAC）焊料的焊点进行了比较。结果表明，相对于SAC的焊点，SACCr中弥散或固溶分布的微量Cr延缓了焊点界面IMC层的生长。时效时间越长，Cr的阻抑效果越明显。150 ℃时效1000 h 的Cu/SACCr/Cu焊点界面IMC层的平均厚度是Cu/SAC/Cu的45%，仅为5.13 μm。

Abstract:

The morphology and growth behavior of interfacial intermetallic compound (IMC) layer for the Sn3.0Ag0.5Cu0.05Cr (SACCr)/Cu joints after isothermal aging at 150 °C for 0, 168, 500 and 1000 h were investigated, and they were compared with Sn3.0Ag0.5Cu (SAC). The results show that the trace Cr dispersed or dissolved in SAC solder effectively inhibits the IMC layer growth at the interface of SACCr/Cu joints. The longer the aging time, the more obvious the inhibiting effect of Cr on the overgrowth of IMC layer of solder/Cu joints. The average thickness of IMC layer of SACCr/Cu solder joints is about 5.13 μm after aging for 1000 h, only 45% of that of the SAC/Cu solder joints.