有机溶剂保护对Al/Ni扩散连接的影响规律研究

Study on the Law of Influence of Organic Solvent Surface Protection on Diffusion Bonding of Pure Aluminum to Pure Nickel

摘要:

采用有机溶剂保护实现了纯铝和纯镍的扩散连接。利用扫描电子显微镜、能谱分析以及X射线衍射等分析手段，确定了Al/Ni扩散连接接头典型的界面结构为Al/Al3Ni2/Ni。在扩散连接过程中利用有机溶剂防止铝表面发生二次氧化，相比直接扩散连接可得到更好的焊接质量。研究了连接温度对Al/Ni接头界面结构的影响规律，随着连接温度的升高各反应层厚度逐渐增加。当连接温度为490℃，连接时间为60min，连接压力为2MPa时，接头抗剪强度达到最大值，为17.83MPa，比该工艺下直接扩散连接得到的焊接接头强度提高了约55%。

Abstract:

Diffusion bonding of pure aluminum to pure nickel by organic solvent surface protection has been investigated at various temperatures. The interfacial microstructure of Al/Ni diffusion bonded joint was confirmed to be Al/Al3Ni2/Ni by scanning electron microscope, energy spectrum analysis and X-ray diffraction (XRD) analysis method. The organic solvent was used to protect the "clean surface" against re-oxidation prior to diffusion bonding. Under optimum conditions, the joints with higher shear strength were obtained. As the temperature increased, the thickness of the reaction layers increased gradually. The highest shear strength obtained by organic solvent surface protection bonding was17.83MPa under a pressure of 2MPa for 60 min at temperatures of 490°C, which was 55% higher than those obtained by conventional diffusion bonding.