处理温度对电沉积银石墨复合镀层接触电阻的影响

The effect of treatment temperature on the contact resistance of electro-deposition silver-graphite composite coating

摘要:

本文使用电沉积方法在铜基表面分别制备了纯银层、银石墨复合镀层和纯银/银石墨复合镀层，研究了处理温度对三种镀层接触电阻的影响。研究表明，室温时相同力矩下复合镀层与纯银镀层相比具有更低的接触电阻，5 N m力矩下纯银镀层、银石墨复合镀层和纯银/银石墨复合镀层的接触电阻分别为24.9 μΩ、19.4 μΩ和19.9 μΩ。25~240 ℃处理后，三种镀层的接触电阻变化不大。240~600 ℃处理后，纯银镀层和纯银/银石墨复合镀层的接触电阻随温度增加而逐渐增大，600 ℃处理后5 N m力矩下分别为54.3 μΩ和42.6 μΩ；银石墨复合镀层的接触电阻随温度增加而迅速增大，480 ℃处理后已达125.5 μΩ，镀层表面出现严重“脱皮”现象。

Abstract:

In this paper, the fine silver, silver-graphite and fine silver/silver graphite composite coatings were prepared on copper substrate by the electro-deposition method. The influence of treatment temperature on the contact resistance of three types of composite coating was particularly investigated. At room temperature, the contact resistance of the composite coatings has lower than that of the fine silver coating under the same torque. After heat treatment from 25 ℃ to 240 ℃, there are no significant differences of contact resistance for three types of coating. With the increase of treatment temperature from 240 ℃ to 600 ℃, the contact resistance of the fine silver coating and silver/silver-graphite composite coating gradually increased, and achieved the values of 54.3 μΩ and 42.6 μΩ under the 5 N m torque, respectively. However, the contact resistance of the silver-graphite composite coating rapidly increased with treatment temperature from 240 ℃ to 600 ℃, and achieved the values of 125.5 μΩ at 480 ℃ with the phenomenon of serious desquamate on the coating surface.