W-Ni-Cu功能梯度材料的制备及性能研究

Study on the preparation and properties of W-Ni-Cu functionally gradient materials

摘要:

采用熔盐电沉积与水溶液电沉积工艺制备了W-Ni-Cu复合材料。经800 ℃依次保温60 min、120 min、180 min退火后，可获得梯度层厚度分别为25 μm、35 μm、45 μm的W-Ni-Cu梯度材料，其中Ni起到桥接W和Cu的作用。试样经热冲击和热疲劳试验处理后，表面无突起、裂纹或脱落现象，说明镀层与基体之间具有良好的冶金结合性能。导热性试验表明，在25～800 ℃范围内，纯W板和W-Ni-Cu梯度材料的导热系数随温度升高而降低；相同温度下，纯W板的导热系数比W-Ni-Cu梯度材料的导热系数大，且W-Ni-Cu梯度材料的导热系数随梯度层厚度升高而降低。

Abstract:

W-Ni-Cu compound materials were?obtained?by?using?fused-salt?electrolysis?method?and?aqueous?solution?electrolysis?method. W-Ni-Cu?functional?graded?materials?(FGM)?characterized?with?different?thickness?(25 μm,?35 μm?and?45 μm) were obtained from its compound materials after annealing at?800 ℃ for?60min,?120min?and?180min, respectively, Ni plays a role in bridging Cu and W. Cracks and abscission were not presented?in?the?surface?of?samples?after?thermal?shock?and?thermal?fatigue,?which?indicates?the?material?has?good?bonding?properties. Thermal ?conductivity?tests?were?also?conducted,?the?result?shows?that?the?thermal?conductivity?of?pure?W?plate?and?W-Ni-Cu FGM decrease with increasing temperature (25～800 ℃). The thermal conductivity of pure W plate is higher than that of W-Ni-Cu FGM at the same temperature. The thermal conductivity of W-Ni-Cu FGM decreases with increasing gradient thickness.