TiO2溶胶对Cu-Sn镀层微观组织结构和性能的影响研究

Study on the Effect of TiO2 Sol on the Microstructure and Tribological Properties of Cu-Sn Coating

摘要:

为了进一步提高Cu-Sn镀层的硬度和耐磨性,在保持镀层自润滑性能的基础上,采用纳米溶胶技术与复合电镀技术相结合的方法,将纳米TiO₂溶胶加入到电解液,制备获得TiO₂纳米粒子强化的Cu-Sn-TiO₂复合镀层。通过对显微硬度、摩擦学性能和微观组织结构的分析表明,适量纳米TiO₂溶胶的加入,细化了Cu-Sn镀层组织,提高了镀层的致密性,硬度和耐磨性均较Cu-Sn镀层显著提高。

Abstract:

In order to improve the hardness and wear resistance, ensure the self-lubricating property, Cu-Sn coatings were prepared and strengthened by combining sol-gel method and composite electroplating technology. In the paper, TiO2 Sol was added to the Cu-Sn electroplating bath to obtain nano-particles enhanced Cu-Sn-TiO2 composite coatings. The micro-structure, microhardness and tribological properties were analyzed in detail. The results show that the introduction of the TiO2 Sol in the plating solution leads to change the composition and structure of the composite coatings. The co-deposited TiO2 is uniformly distributed in the Cu-Sn matrix and contributes greatly to improve the microhardness and tribological properties of the Cu-Sn alloy coating.