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SEM-EDS Plane Scan and Line Scan Analysis of TiCN Coatings by Cathodic Arc Ion Plating
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SEM-EDS Plane Scan and Line Scan Analysis of TiCN Coatings by Cathodic Arc Ion Plating
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The Science and Technology Support Project of Jiangsu Province, China (BE2014818)

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    摘要:

    采用阴极弧离子镀在Cr12MoV冷作模具钢表面制备了TiCN涂层,通过扫描电镜(SEM)和能谱仪(EDS)分析了涂层表面化学元素的面分布和界面化学元素的线分布。讨论了涂层界面结合机理,用划痕法对结合强度进行了表征分析。结果表明,涂层主要是由TiN、TiC和C原子组成,其中TiN和TiC提高了涂层硬度,C原子改善了涂层摩擦润滑性能;涂层中N原子分数超过C原子分数,界面结合处发生了相互扩散,涂层中C原子扩散量最大,基体中Si原子扩散量最大,涂层与基体形成了冶金结合,利用划痕法测定TiCN涂层结合强度为79.6 N

    Abstract:

    A TiCN coating was deposited on Cr12MoV cold worked die steel by cathodic arc ion plating (CAIP). The plane distributions of chemical elements and the line scans of chemical elements at the coating interface were analyzed by SEM (scanning electron microscopy) and EDS (energy dispersive spectroscopy). The interface bonding mechanism was discussed, and the interface bonding of the coating was characterized and analyzed with scratch tester. The results show that the TiCN coating is composed of TiN, TiC and C atom, of which the TiC and TiN increase the coating hardness, and the C atom improves the friction lubrication properties of the coating. The number of N atoms in the coating is higher than that of C atoms, and the mutual diffusions occur at the bonding interface between the coating and the substrate. The C atoms diffuse to the substrate more than other atoms of elements in the coating, so Si atoms in the substrate, and a metallurgical bonding is formed between the coating and the substrate, its bonding with strength of 79.6 N

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孔德军,王进春,郭皓元,王文昌. SEM-EDS Plane Scan and Line Scan Analysis of TiCN Coatings by Cathodic Arc Ion Plating[J].稀有金属材料与工程,2015,44(12):3000~3004.[Kong Dejun, Wang Jinchun, Guo Haoyuan, Wang Wenchang. SEM-EDS Plane Scan and Line Scan Analysis of TiCN Coatings by Cathodic Arc Ion Plating[J]. Rare Metal Materials and Engineering,2015,44(12):3000~3004.]
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  • 收稿日期:2014-12-19
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  • 在线发布日期: 2016-08-29
  • 出版日期: 2015-12-25