Preparation and Properties of W-15Cu Composite by Electroless Plating and Powder Metallurgy

摘要:

用化学镀和粉末冶金的方法制备出W-15Cu复合材料。首先用化学方法对W粉表面预处理，然后在其表面化学镀铜。得到的复合粉末用图谱进行表征。发现用化学镀的方法制备出的W-15Cu复合粉末纯度非常高，且W颗粒均匀、被Cu致密的包覆着。呈现出包状结构。这种复合粉末表现出优异的压制性能，压坯分别在300, 400, 500, 600 MPa的压制压力下成形。压坯在1250 ℃温度下保温90 min烧结后，从其断口形貌可以发现W颗粒没有明显的长大，且W颗粒表面特征并没有发生改变，仍然表现出预处理后的表面特征。对烧结体的相对密度、硬度、抗弯强度和电导率同样进行了表征

Abstract:

W-15Cu composite samples were prepared by electroless plating (for composite powder) and powder metallurgy (for sintering samples). Starting W powder was activated by a chemical pretreatment first, and then the pretreated W powder was electroless plating to get Cu-cladded W powder, which was pressed into green compacts at different pressing pressures. Afterward, the composite was sintered into W-15Cu composite samples, and Cu-cladded W powder was characterized. The relative density, hardness, compressive strength and electrical conductivity of the composite samples were tested. The morphologies of the Cu-cladded W powder and the samples were investigated. Results show that the prepared powder has good compaction behavior with high purity, uniform particle size and a dense Cu cladding layer. W particles still remain sole ones and no obvious grain coarsening appears in the sintering samples, while 3D Cu network is all over the structure of the samples. The electrical conductivity and the compressive strength of the sample change with pressing pressure and sintering temperature