钨铜合金表面纳米化及其性能分析

Tungsten-Copper Alloy Surface Nano-crystallization and Its Properties

摘要:

采用超音速微粒轰击法在CuW70假合金表面制备出一定厚度的纳米晶层，测其硬度及电性能，并利用XRD和SEM对其物相及显微形貌进行分析。结果表明，在实验过程中，轰击微粒以很高的动能连续作用于W-Cu合金表面，致使W颗粒和粘结相铜细化，最终在合金表层制备出晶粒尺寸约80 nm、厚度约十几微米的纳米层，且最佳纳米化效果出现在次表层。此外，显微硬度值较原始基体提高40%~60%；而电导率基本未变。再者，表面纳米化能够抑制电弧的形成和快速熄灭电弧，可达到抗电弧烧蚀的目的

Abstract:

Nanocrystalline layer of a certain thickness has been prepared on the surface of tungsten copper alloy by a supersonic fine particles bombarding (SFPB) method. The micro-hardness and electrical properties were measured and then their phases as well as microstructure were analyzed by XRD and SEM, respectively. The results show that the continuous bombardment on the surface of tungsten copper alloy leading by high kinetic energy of particles during SFPB makes the W particles and copper phase broken and refined. Finally a nano layer has been prepared on the surface of CuW70, whose grain size is about 80 nm and the thickness is about a dozen microns. And the optimum effect is in the subsurface. Micro-hardnesses of the sample’s nano layer significantly increase by about 40%~60% while the conductivity decreases slightly. The formation of the arc can be inhibited and extinguished rapidly for achieving the arc erosion resistance