环境友好的ABS板铜催化的铜金属化

Environmentally friendly Copper metallization of ABS by Cu-catalysed electroless process

摘要:

一种新型的环境友好的ABS表面微蚀和活化技术以代替传统的铬酸微蚀和钯催化活化技术。H₂SO₄-MnO₂微蚀后,ABS板表面变得粗糙,在其表面出现大量的羟基和羧基。通过吸附和硼氢化钠的还原,铜粒子沉积在ABS板表面,以取代SnCl₂/PdCl₂胶体催化活化。本文研究了硫酸铜、硼氢化钠浓度,还原剂温度、还原时间对化学铜ABS板表面粘结强度的影响。最终本实验的粘结强度达到0.87 KN m_-1.

Abstract:

An environment-friendly surface etching and activation technics for ABS surface metallization were investigated as a replacement for conventional chromic acid etching bath and palladium catalyst. After etching by H₂SO₄-MnO₂ colloid, the ABS surfaces become roughness; meanwhile the carboxyl and hydroxyl groups were formed on the surface. With absorption and a reduction by a sodium borohydride solution, copper particles were deposited on the ABS surface, which serves as a catalyst replacement for SnCl₂/PdCl₂ colloid. The effects of CuSO₄ concentration, NaBH₄ concentration, reduction temperature and reduction time on the adhesion strength between the ABS surface and the electroless copper film were investigated. The average adhesion strengths reached 0.87 KN m_-1.