工艺参数及稳定剂抗坏血酸对电沉积NiFeW合金的影响

Effect of process parameters andascorbic acid on the electrodeposition NiFeW alloys

摘要:

为获得性能良好的镍铁钨合金镀层,研究了镀液pH 值、温度、电流密度、稳定剂抗坏血酸浓度对镍铁钨合金镀层成分和镀层沉积速率、显微硬度的影响。结果表明: 镀液pH 值对镀层W含量和镀层沉积速率影响较大；镀液温度对镀层沉积速率、镀层成分和镀层硬度影响均较大；随抗坏血酸浓度增加,镀层沉积速率逐渐降低,镀层表面形貌更加粗糙。在镀液pH = 4,温度60 ℃,电流密度4 A/dm2,抗坏血酸浓度3 g /L 时,镀层沉积速率和镀层的显微硬度较高,表面光亮致密,耐蚀性好。

Abstract:

In order to obtain NiFeW alloy coating with good performance, we studied the influence of pH value, temperature, current density, and the concentration of ascorbic acid stabilizer on the composition, deposition rate, and microhardness of NiFeW alloy coating. The results show that 1) the pH value of plating bath largely influences the concentration of W and the deposition rate of coating; 2) the temperature of plating bath largely influences the deposition rate, composition, and microhardness of coating; and 3) upon increasing the concentration of ascorbic acid, the deposition rate of coating decreases whereas the surface morphology of coating becomes more rough. With a pH of plating bath equal to 4, a temperature of 60 ℃, a current density of 4 A/dm₂, and an ascorbic-acid concentration of 3 g/L, both the deposition rate and the hardness of the coating are high. In addition, both the surface quality and the corrosion resistance of the coating are good.