RE及Ni对Zn20Sn高温无铅钎料显微组织及性能的影响

The Influence of RE and Ni on the Microstructure and Properties of Zn20Sn High-temperature Lead-Free Solder

摘要:

在Zn20Sn高温无铅钎料合金中添加0.1wt.%RE及0.2~0.8wt.%Ni，研究了RE及Ni对钎料合金显微组织及性能的影响。结果表明，在Zn20Sn中同时添加0.1wt.%RE及0.2~0.8wt.%Ni后，钎料合金的固相线变化不大，而液相线温度降低；RE及Ni对钎料合金的润湿性能及显微硬度有明显的影响，当RE为0.1wt.%、Ni为0.4wt.%时，钎料合金的润湿性能最好、显微硬度最高；随着RE及Ni的添加，在钎料合金中形成了含Ni金属间化合物，且随着Ni含量的提高，金属间化合物的形状、钎料合金的组织结构发生显著变化。

Abstract:

0.1wt.% RE and 0.2~0.8wt.% Ni were added into the Zn20Sn high-temperature lead-free solder. The effects of RE and Ni additions on the microstructure and properties of the solder alloys were investigated. The results show that the solidus temperature of solder alloys is not distinctly affected when the 0.1 wt.% RE and 0.2%~0.8wt.% Ni were added into Zn20Sn solder alloys, whereas the liquidus temperature is decreased, the wettability and microhardness are significantly improved. The solder alloy shows best wettability and highest microhardness when the content of RE is 0.1wt.% and Ni is 0.4wt.%. Ni-containing intermetallic compounds formed in solder alloys and the amount of intermetallic compounds gradually increaseed with increasing Ni content, and the shape of intermetallic compounds and the microstructure of solder alloys are significantly changed.