Cu/Al固液连接界面组织演化的定量分析

Quantitative Analysis of Microstructural Evolution at Cu/Al Solid-Liquid Bonding Interface

摘要:

采用固-液法快冷成型制备了Cu/Al整体材料。利用SEM，EDS，XRD等分析了Cu/Al界面的微观结构和相组成，基于扩散方程并结合相图定量分析了Cu/Al界面组织演化过程。结果表明：从Cu侧至Al侧，界面依次形成了区域Ⅰ(AlCu+Al2Cu)混合组织，过共晶组织 [Al2Cu+(Al2Cu+α-Al)]的区域Ⅱ和亚共晶组织 [α-Al+(Al2Cu+α-Al)]的区域Ⅲ；随着界面Cu浓度的变化，Al2Cu相具有不同形貌；且各个区域厚度同理论值基本一致。

Abstract:

The Cu/Al diffusion couples were prepared by solid-liquid bonding method. Interfacial microstructure and phase composition were investigated by scanning electron microscope (SEM), energy dispersive spectrometry (EDS) and X-ray differential (XRD). Moreover, the microstructural evolution of Cu/Al interface was quantitatively analyzed on the basis of diffusion theory and phase diagram. The results reveal that: the interface consists ofⅠ(AlCu+Al2Cu), hypereutectic microstructureⅡ[Al2Cu+(α-Al+Al2Cu)] and hypoeutectic microstructure Ⅲ [α-Al+(α-Al+Al2Cu)] from Cu side to Al side accordingly. Further, there are various morphologies of Al2Cu phase formed with the decreasing of Cu concentration. Additionally, the thickness of three diffusion zones is basically identical with the theoretical prediction.